基于同轴结构的高速VCSEL管座设计方法

深圳大学光电工程学院,光电子学研究所,深圳 518060

通信技术; 垂直腔面发射激光器; 同轴封装; 高频性能; 等效电路模型; 结构参数; 介电常数

An optimized design based on coaxial packaging of the high speed VCSEL
Chai Guangyue, Liu Qiang, Xu Guanghui, and Duan Zigang

Chai Guangyue, Liu Qiang, Xu Guanghui, and Duan ZigangCollege of Optoelectronic Engineering, Institute of Optoelectronics, Shenzhen University, Shenzhen 518060, P.R.China

communication technology; vertical cavity surface emitting laser(VCSEL); coaxial package; high frequency performance; equivalent circuit model; structure parameters; relative permittivity

DOI: 10.3724/SP.J.1249.2014.05493

备注

基于垂直腔面发射激光器(vertical cavity surface emitting laser,VCSEL)的同轴管壳封装等效电路模型,分析影响器件高频性能的封装寄生参量. 结合量产要求,通过调节管壳的部分结构参数与介质材料的介电常数,提高器件频率响应. 分析结果表明,优化设计后的器件高频性能得到显著提高.

The high speed, low cost vertical cavity surface emitting laser(VCSEL)is widely used in many fields such as the storage area network. According to the recent news release of the Fabre Channel Industry Association, the transmission rate of the fiber channel standard has reached 16 Gbit/s. Because of its low cost and suitability for mass production, through-hole(TO)tube has been widely used in the VCSEL whose rate is less than 10 Gbit/s. Packaging is an important step to achieve the high-frequency performance for the VCSEL. Based on the equivalent circuit model of VCSEL coaxial package, this paper analyses some package parasitic parameters that can affect the high-frequency performances of devices. And to meet with the mass production requirements in factories, the device frequency response is optimized by adjusting parts of structure parameters and the relative permittivity of filling materials. The results show that the high-frequency performances of devices are improved remarkably after the optimization design.

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