深圳大学学报理工版

基于印刷电路板(printed circuit board, PCB)介质的芯片间无线互连结构,设计一种60 GHz单极子天线.天线半径为0.04 mm,长度为0.84 mm,天线1、2、3和4代替4个芯片的4个管脚,伸入PCB介质中(厚度为2 mm,面积为20 mm×20 mm).天线1为发射端,其余为接收端.利用HFSS软件仿真得到模型中天线间的S参数S11、 S21、 S31和S41分别为-19.00、-64.75、-64.75和-76.30 dB.以5 V、60 GHz正弦波信号激励发射天线,接收天线2、3和4分别收到振幅为4.80、4.80和0.47 mV.当发射激励为120 Gbit/s伪随机二进制码时,接收天线收到的信号眼图清晰,理论验证了利用单极子天线实现基于PCB的芯片间无线互连的可行性.

The inter-chip wireless connection structure based on PCB medium is presented, and a 60 GHz monopole antenna is designed. The radius of the antenna is 0.04 mm, and it is 0.84 mm in length. Antenna 1, 2, 3 and 4 replace four pins of four different chips and penetrate into the PCB's medium, whose thickness is 2 mm, area is 20 mm×20 mm. Take antenna 1 as the transmitter and others as the receivers. The S-parameters of the model are simulated by using HFSS software. The simulation results of S11, S21, S31 and S41 are -19.00, -64.75, -64.75 and -76.30 dB, respectively. When the source is driven by a 60 GHz sine wave with the amplitude of 5 V, the amplitudes of signal received by the antenna 2, 3 and 4 are respectively 4.80, 4.80 and 0.47 mV. When the source is alternated by the 120 Gbit/s pseudo random binary code, the eye diagram of the receiver is clear, which verifies the feasibility of the monopole antenna used for inter-chip wireless connection.

引言
1 芯片间无线互连结构设计
2 用于无线互连的单极子天线设计
3 仿真结果分析
4 结语

图1 基于PCB的芯片间互连结构<br/>Fig.1 Interconnects for chips based on PCB

图1 基于PCB的芯片间互连结构
Fig.1 Interconnects for chips based on PCB

图2 直角坐标系中半波偶极子天线<br/>Fig.2 Half-wavelength dipole antenna in rectangular coordinate system

图2 直角坐标系中半波偶极子天线
Fig.2 Half-wavelength dipole antenna in rectangular coordinate system

图3 基于PCB实现芯片间无线互连的4天线结构图 <br/>Fig.3 Four antennas structure for inter-chip wireless connection based on PCB

图3 基于PCB实现芯片间无线互连的4天线结构图
Fig.3 Four antennas structure for inter-chip wireless connection based on PCB

图4 各天线的S参数曲线<br/>Fig.4 S parameters of every antenna

图4 各天线的S参数曲线
Fig.4 S parameters of every antenna

图5 未加3个接收天线时发射天线三维辐射方向图<br/>Fig.5 The transmitting antenna's three-dimension directional diagram without the three receiving antennas

图5 未加3个接收天线时发射天线三维辐射方向图
Fig.5 The transmitting antenna's three-dimension directional diagram without the three receiving antennas

图6 增加3个接收天线后的天线三维辐射方向图<br/>Fig.6 The transmitting antenna's three-dimension directional diagram with the three receiving antennas

图6 增加3个接收天线后的天线三维辐射方向图
Fig.6 The transmitting antenna's three-dimension directional diagram with the three receiving antennas

图7 发射天线在X-Y平面上的辐射增益<br/>Fig.7 The transmitting antenna's radiate gain in X-Y plane

图7 发射天线在X-Y平面上的辐射增益
Fig.7 The transmitting antenna's radiate gain in X-Y plane

图8 4天线结构电路仿真<br/>Fig.8 Circuit simulation for 4 antennas structure

图8 4天线结构电路仿真
Fig.8 Circuit simulation for 4 antennas structure

图9 接收端时域信号波形<br/>Fig.9 Signal waveform in time domain for receiving ports

图9 接收端时域信号波形
Fig.9 Signal waveform in time domain for receiving ports

表1 60 GHz正弦波激励下接收端信号幅值<br/>Table 1 Signal magnitudes of receiving ports under excitation of 60 GHz sine wave

表1 60 GHz正弦波激励下接收端信号幅值
Table 1 Signal magnitudes of receiving ports under excitation of 60 GHz sine wave

图10 接收端信号眼图<br/>Fig.10 Signal eye diagram in receiving terminal

图10 接收端信号眼图
Fig.10 Signal eye diagram in receiving terminal

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备注

引言

1 芯片间无线互连结构设计

2 用于无线互连的单极子天线设计

3 仿真结果分析

4 结语

期刊信息

备注

引言

1 芯片间无线互连结构设计

2 用于无线互连的单极子天线设计

3 仿真结果分析

4 结 语

期刊信息

4 结语