[1]倪卓,林煜豪,郭震,等.自修复环氧树脂微胶囊合成及其反应机理[J].深圳大学学报理工版,2019,(No.3(221-346)):319-326.[doi:10.3724/SP.J.1249.2019.03229]
 NI Zhuo,LIN Yuhao,GUO Zhen,et al.Synthesis and reaction mechanism of self-healing epoxy microcapsules[J].Journal of Shenzhen University Science and Engineering,2019,(No.3(221-346)):319-326.[doi:10.3724/SP.J.1249.2019.03229]
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自修复环氧树脂微胶囊合成及其反应机理()
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《深圳大学学报理工版》[ISSN:1000-2618/CN:44-1401/N]

卷:
期数:
2019年No.3(221-346)
页码:
319-326
栏目:
【化学与化工】
出版日期:
2019-05-20

文章信息/Info

Title:
Synthesis and reaction mechanism of self-healing epoxy microcapsules
作者:
倪卓林煜豪郭震陈书田袁秋华
深圳大学化学与环境工程学院,广东深圳 518060
Author(s):
NI Zhuo LIN Yuhao GUO Zhen CHEN Shutian and YUAN Qiuhua
College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, Guangdong Province, P.R.China
关键词:
复合材料环氧树脂囊壁自修复微胶囊反应机理
Keywords:
composite material epoxy resin wall self-healing microcapsules reaction mechanism
分类号:
TQ323.5
DOI:
10.3724/SP.J.1249.2019.03229
文献标志码:
A
摘要:
以环氧树脂作为囊芯材料,采用界面聚合法以三乙烯四胺为固化剂制备一种在环氧树脂液滴表面形成交联结构环氧树脂囊壁包覆环氧树脂液芯的自修复微胶囊. 设计L9(34)正交试验,研究乳化剂用量、固化剂用量、固化温度及固化剂滴加速率对环氧树脂微胶囊囊芯含量和储存期的影响. 采用扫描电镜和广角静态动态同步激光散射仪分别对微胶囊表面形貌、粒径大小及分布情况进行表征,采用傅里叶变换红外光谱和热失重分析仪分别研究环氧树脂微胶囊囊壁的反应机理及环氧树脂微胶囊热稳定性. 实验表明:乳化剂用量为1.2%,固化剂用量为1.2%,固化剂滴加速率为1.2 g/h,固化温度为50 ℃时,制得的微胶囊呈规则球形,表面致密性及分散性好、热稳定性好. 囊芯质量占比为82.3%,平均粒径为275.3 μm,这种环氧树脂微胶囊化学稳定性较差,在室温放置12 d后囊芯含量下降2.0%. 通过万能电子拉力机对质量分数为2% 的200~300 μm微胶囊的环氧树脂复合材料进行损伤,经修复后测得修复率为67.04%.
Abstract:
The self-healing epoxy resin microcapsules were prepared by interfacial polymerization, the core materials are epoxy resin, the wall materials are condensated by triethylenetetramine (TETA) and the epoxy resin E-51. The orthogonal experiments L9 (34) were designed to investigate the influence of emulsifier dosage, hardener dosage, curing temperature and hardener adding rate on the epoxy resin microcapsule core content and storage life. Scanning electron microscope and dynamic wide angle laser light scattering instrument synchronization (DLS) were adopted to characterize the surface topography, particle size and distribution. Fourier transform infrared spectroscopy and thermo gravimetric analyzer were used to study the reaction mechanism of the microcapsule wall materials and the thermal stability of the microcapsules, respectively. The results indicated that these spherical microcapsules have good surface compactness, good dispersibility and heat stability, when the emulsifier dosage was 1.2%, hardener dosage was 1.2%, the hardener adding rate was 1.2 g/h and curing temperature was 50 °C, the capsule core content was 82.3% and the mean particle size was 275.3 μm. This type of epoxy resin microcapsule had relatively poor chemical stability, the core content decreased 2.0% after storage at room temperature for 12 days. The epoxy resin composite doped with 2% 200-300 μm microcapsules was damaged by tensile testing machine, the repair rate was 67.04%.

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更新日期/Last Update: 2019-04-22