[1]贵大勇,郝景峰,赖玉丽,等.有机硅改性环氧树脂制备及热稳定性[J].深圳大学学报理工版,2011,28(No.6(471-564)):507-512.
 GUI Da-yong,HAO Jing-feng,LAI Yu-li,et al.Modification of epoxy resin with diphenyl silanediol and its thermal stability[J].Journal of Shenzhen University Science and Engineering,2011,28(No.6(471-564)):507-512.
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有机硅改性环氧树脂制备及热稳定性()
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《深圳大学学报理工版》[ISSN:1000-2618/CN:44-1401/N]

卷:
第28卷
期数:
2011年No.6(471-564)
页码:
507-512
栏目:
化学与化工
出版日期:
2011-11-20

文章信息/Info

Title:
Modification of epoxy resin with diphenyl silanediol and its thermal stability
文章编号:
1000-2618(2011)06-0507-06
作者:
贵大勇郝景峰赖玉丽李海红陈燕婷周佳松谭紫文
深圳大学化学与化工学院,深圳市功能高分子重点实验室, 深圳 518060
Author(s):
GUI Da-yongHAO Jing-fengLAI Yu-liLI Hai-hongCHEN Yan-tingZHOU Jia-songand TAN Zi-wen
College of Chemistry and Chemical Engineering, Shenzhen Key Laboratory of Functional Polymer, Shenzhen University, Shenzhen 518060, P.R.China
关键词:
有机高分子材料环氧树脂有机硅树脂复合材料热失重热膨胀系数改性
Keywords:
organic polymer materialsepoxy resinssilicone resinscomposite materialsthermogravimetrycofficient of thermal expansionmodification
分类号:
O 632.7
文献标志码:
A
摘要:
采用二苯基硅二醇与双酚A型环氧树脂(E-44)反应,制备有机硅环氧树脂及其固化物.通过正交和单因素实验研究原料物质的量比、反应温度和时间对树脂热稳定性的影响,用热机械分析仪、热失重分析仪、傅立叶变换红外光谱仪和化学滴定分析等对改性树脂进行表征.结果表明,用二苯基硅二醇改性E-44,在催化剂为二丁基二月桂酸锡,二苯基硅二醇与E-44物质的量比1∶4,反应温度110 ℃,反应时间2 h时,得综合热稳定性能优异的有机硅改性环氧树脂,较未改性环氧树脂,其热膨胀系数下降33.2%,内应力参数下降36.3%,初始热分解温度提高15 ℃,而玻璃化转变温度无明显降低,有良好的热稳定性.
Abstract:
Modification of epoxy resin with organic silicone is an effective method to prepare the new thermosetting epoxy resin with high thermal stability,low shrinkage,and good mechanical properties.Diphenyl silanediol and bisphenol A epoxy resins (E-44) were used to prepare the silicone-epoxy resins and the cured materials.The chemical structure and thermal mechanical properties of the modified resins were characterized by thermal mechanical analyzer (TMA),thermogravimetric analysis (TGA),infrared spectroscopy (IR),etc.The optimized synthesis conditions are determined by the orthogonal and single-factor experimental design as molar ratio (diphenyl silicone diol/E-44) (1∶4),reaction temperature (110 ℃),and reaction times (2 hours).The results show that the coefficient of thermal expansion and thermal stress parameter of the diphenyl siliconediol modified epoxy resins decrease 33.2% and 36.3% respectively,the decomposition temperature increase 15 ℃ and the glass transition temperature has no significant decline compared with those of unmodified epoxy resin,exhibiting good thermal stability.

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备注/Memo

备注/Memo:
收稿日期:2010-07-05;修回日期:2011-06-08
基金项目:国家重点基础研究发展计划基金资助项目(2011CB605603)
作者简介:贵大勇(1963-),男(汉族),湖南省常德市人,深圳大学教授.E-mail:dygui@szu.edu.cn
更新日期/Last Update: 2011-11-22