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[1]ZENG Ai-xiang,XIONG Wei-hao,XU Jian.Electroless Ni-P coating of cenospheres using silver nitrate activator[J].Surface and Coatings Technology,2005,197:142-147.
[2]Marshall G.W,Lewis D B,Clayton D.The electrodeposition of Ni-P-Al2O3 deposits[J].Surface and Coatings Technology,1997,96:353-358.
[3]Shukla S,Seal S,Akesson J.Study of mechanism of electroless copper coating of fly-ash cenosphere particles[J].Appl Surf Sci,2001,181(1):35-50.
[4]Shukla S,Seal S,Rahaman Z.Electroless copper coating of cenospheres using silver nitrate activator[J].Mater Lett,2002,57:151-156.
[5]Stephen F,Rudy.Surface preparation of various metal sand alloys before plating and other finishing applications[J].Metal Finishing,2001,99:191-205.
[6]ZHANG Shu-sheng,HAN Ke-jiang,CHENG Lin.The effect of SiC particles added in electroless Ni-P plating solution on the properties of composite coatings[J].Surface and Coatings Technology,2008,202(12):2807-2812.
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