Information
JOURNAL OF SHENZHEN UNIVERSITY SCIENCE AND ENGINEERING
(Started in 1984, Bimonthly)
Responsible Institution
Shenzhen University
Sponsor
Shenzhen University
Edited by
Editorial Department of Journal of Shenzhen University Science and Engineering
Science Press
Chief editor
Li Qingquan
Distributed Domestically
Shenzhen Post Office
Distributed Abroad
China International Book Trading Corporation,(P.O.Box 399.Beijing,P.R.China)
Address
16 Donghuangchenggen North Street, Beijing 100717, P.R. China
Tel
0755-26732266
0755-26538306
Email:
journal@szu.edu.cn
 The Journal of Shenzhen University Science and Engineering is a general science and technology academic journal, managed and produced by Shenzhen University, and published by Science Press.It was first published in 1984. It is issued on a bimonthly basis (appearing on odd months) as an A4, 112-page magazine, distributed both domestically and overseas.
  The Journal publishes articles and letters covering a wide range of fields, including Electronics & Information Science, Optoelectronic Engineering,Architecture & Cvil Engineering,  Bioengineering, Environmental Science & Energy,  Transportation Logistics, Chemistry & Chemical Engineering, Materials Science,Mathematics & Applied Mathematics, and Physics & Applied Physics.
  The Journal is recognized as a core Chinese science and technology journal by the Overview of Core Chinese Periodicals (published by the Peking University Library) and the Statistical Source Journal for Chinese Science and Technology Articles (published by the Institute of Scientific and Technical Information of China [ISTIC]). It is also indexed by many authoritative domestic and international databases, including the Chinese Science Citation Database (CSCD), the Annual Report for Chinese Academic Joural Impact Factors (Natural Science), SCOPUS (based in the Netherlands), INSPEC (based in UK), EBSCO(based in USA),and Zentralblatt MATH (based in Germany). The Journal’s 2020 impact factor was 0.738, and the 2020 5-year impact factor was 0.797.
  We warmly welcome high-quality contributions from researchers and scholars from around the world!
Current Issue
Accepted Paper
In Press
Transportation Logistics
Architecture & Civil Engineering
ZHANG Yafang1, GUO Zhongxiang1, LIU Hao1, 2, HE Juan1, and LU Juan1
[Abstract] [PDF: 8797KB]
ZHANG Jianchao1, 2, PENG Shaocheng2, KUANG Chuan2, WENG Jianwu2, DONG Biqin2, HONG Shuxian2, and XING Feng1, 2
[Abstract] [PDF: 5771KB]
LV Jiang1, ZHAO Hui1, YANG Biao2, ZHAO Jiachen3, and SUN Honglei2
[Abstract] [PDF: 2988KB]
CHEN Feng1, 2, TONG Shenghao2, REN Jianhua3, and JIAN Wenbin2
[Abstract] [PDF: 4684KB]
LIU Shengjie1, 2, XIE Zhengzhuan1, and PENG Aihong3
[Abstract] [PDF: 4083KB]
Electronics and Information Science
HE Yulin1, 2, JIN Yi3, DAI Dexin1, HUANG Baihao1, and HUANG Jiajie1
[Abstract] [PDF: 6325KB]
WANG Jinghong1, 2, FENG Chan3, and CHAI Bianfang4
[Abstract] [PDF: 2361KB]
Bioengineering
HUANG Ying, LI Xiaolian, YIN Jianbo, LIN Yongqi, PENG Xiaobo, and JIA Bin
[Abstract] [PDF: 4067KB]
SHAO Yixin1, 2, GUAN Tianmin1, ZHU Ye1, and CHEN Xiangyu1
[Abstract] [PDF: 6329KB]
Mathematics & Applied Mathematics