Information
JOURNAL OF SHENZHEN UNIVERSITY SCIENCE AND ENGINEERING
(Started in 1984, Bimonthly)
Responsible Institution
Shenzhen University
Sponsor
Shenzhen University
Edited by
Editorial Department of Journal of Shenzhen University Science and Engineering
Science Press
Chief editor
Li Qingquan
Distributed Domestically
Shenzhen Post Office
Distributed Abroad
China International Book Trading Corporation,(P.O.Box 399.Beijing,P.R.China)
Address
16 Donghuangchenggen North Street, Beijing 100717, P.R. China
Tel
0755-26732266
0755-26538306
Email:
journal@szu.edu.cn
 The Journal of Shenzhen University Science and Engineering is a general science and technology academic journal, managed and produced by Shenzhen University, and published by Science Press.It was first published in 1984. It is issued on a bimonthly basis (appearing on odd months) as an A4, 112-page magazine, distributed both domestically and overseas.
  The Journal publishes articles and letters covering a wide range of fields, including Electronics & Information Science, Optoelectronic Engineering,Architecture & Cvil Engineering,  Bioengineering, Environmental Science & Energy,  Transportation Logistics, Chemistry & Chemical Engineering, Materials Science,Mathematics & Applied Mathematics, and Physics & Applied Physics.
  The Journal is recognized as a core Chinese science and technology journal by the Overview of Core Chinese Periodicals (published by the Peking University Library) and the Statistical Source Journal for Chinese Science and Technology Articles (published by the Institute of Scientific and Technical Information of China [ISTIC]). It is also indexed by many authoritative domestic and international databases, including the Chinese Science Citation Database (CSCD), the Annual Report for Chinese Academic Joural Impact Factors (Natural Science), SCOPUS (based in the Netherlands), INSPEC (based in UK), EBSCO(based in USA),and Zentralblatt MATH (based in Germany). The Journal’s 2020 impact factor was 0.738, and the 2020 5-year impact factor was 0.797.
  We warmly welcome high-quality contributions from researchers and scholars from around the world!
Current Issue
Accepted Paper
In Press
Optoelectronics Engineering
SHAO Yonghong, ZHENG Xiaomin, WANG Lei, WU Wenshuai, ZHOU Jie, and CHEN Jiajie
[Abstract] [PDF: 4735KB]
LIU Zexiang1, 2, ZHOU Bo2, FANG Shaofan2, and SHI Yumeng2
[Abstract] [PDF: 3026KB]
OU Yue1, 2, LIU Wenxin1, 2, ZHAO Zhengyuan1, YANG Longlong1, WANG Weilong1, and ZHANG Zhaochuan1
[Abstract] [PDF: 5765KB]
WANG Yixuan1, 2, WANG Daming1, 2, JIA Zhiwei1, 2, and WANG Anbang1, 2
[Abstract] [PDF: 4669KB]
XU Hao1, 2, QIAO Lijun1, 2, ZHANG Mingjiang1, 2, ZHANG Jianzhong1, 2, WANG Tao1, 2, and GAO Shaohua1, 2
[Abstract] [PDF: 3901KB]
Materials Science
GONG Lulu1, LUO Guoqi2, YAO Jun1, YIN Xiaolong3, CHEN Huanhui3, and REN Xiangzhong3
[Abstract] [PDF: 6914KB]
YUAN Qiuhua, SHI Xin, LIANG Jinren, WAN Lei, JIAN Youliang, YANG Yuan, LI Ruilong, DAI Xiaoyi, and WU Wenshan
[Abstract] [PDF: 5832KB]
Bioengineering
CHEN Yang, CHEN Xianxiong, OUYANG Chunyan, ZHONG Yonghao, and LIU Xiaoyu
[Abstract] [PDF: 2885KB]
Electronics and Information Science
YU Junqi, WANG Jiali, ZHAO Anjun, XIE Yunfei, RAN Tong, and ZHAO Zehua
[Abstract] [PDF: 4149KB]