Information
JOURNAL OF SHENZHEN UNIVERSITY SCIENCE AND ENGINEERING
(Started in 1984, Bimonthly)
Responsible Institution
Shenzhen University
Sponsor
Shenzhen University
Edited by
Editorial Department of Journal of Shenzhen University Science and Engineering
Science Press
Chief editor
Li Qingquan
Distributed Domestically
Shenzhen Post Office
Distributed Abroad
China International Book Trading Corporation,(P.O.Box 399.Beijing,P.R.China)
Address
16 Donghuangchenggen North Street, Beijing 100717, P.R. China
Tel
0755-26732266
0755-26538306
Email:
journal@szu.edu.cn
 The Journal of Shenzhen University Science and Engineering is a general science and technology academic journal, managed and produced by Shenzhen University, and published by Science Press.It was first published in 1984. It is issued on a bimonthly basis (appearing on odd months) as an A4, 112-page magazine, distributed both domestically and overseas.
  The Journal publishes articles and letters covering a wide range of fields, including Electronics & Information Science, Optoelectronic Engineering,Architecture & Cvil Engineering,  Bioengineering, Environmental Science & Energy,  Transportation Logistics, Chemistry & Chemical Engineering, Materials Science,Mathematics & Applied Mathematics, and Physics & Applied Physics.
  The Journal is recognized as a core Chinese science and technology journal by the Overview of Core Chinese Periodicals (published by the Peking University Library) and the Statistical Source Journal for Chinese Science and Technology Articles (published by the Institute of Scientific and Technical Information of China [ISTIC]). It is also indexed by many authoritative domestic and international databases, including the Chinese Science Citation Database (CSCD), the Annual Report for Chinese Academic Joural Impact Factors (Natural Science), SCOPUS (based in the Netherlands), INSPEC (based in UK), EBSCO(based in USA),and Zentralblatt MATH (based in Germany). The Journal’s 2020 impact factor was 0.738, and the 2020 5-year impact factor was 0.797.
  We warmly welcome high-quality contributions from researchers and scholars from around the world!
Current Issue
Accepted Paper
In Press
Sponge City
PENG Shijin1, HU Aibing2, SHI Jinghua1, LI Chunju3, LIU Kan1, WU Jianxiong1, LI Minhao1, and LU Min1
[Abstract] [PDF: 12781KB]
LIU Jian1, LIU Pai1, WANG Xiaolei2, LIU Shaoran2, WANG Gang3, WU Shuang4, GONG Xiaoqiang1, and WU Lingyi1
[Abstract] [PDF: 4920KB]
YANG Yahong1, YANG Xingfeng1, YAN Junjiang1, and YU Yang2
[Abstract] [PDF: 6502KB]
CAI Yezhao1, LIU Dongxuan1, LIU Jian2, SHE Nian1, 2, and GONG Xiaoqiang2
[Abstract] [PDF: 11822KB]
Architecture & Civil Engineering
LIU Guoguang1, 2, 3, PEI Leiyang1, YANG Yuemin1, and LI Shinan1, 4
[Abstract] [PDF: 4201KB]
FANG Naren1, 2, HU Shiqing2, WANG Xuancang2, LI Qiqi2, and XIN Lei2
[Abstract] [PDF: 3846KB]
Electronics and Information Science
HONG Kaidong1, ZHANG Xiao1, ZHU Lei2, CHEN Zhe1, and YUAN Tao1
[Abstract] [PDF: 4746KB]
Optoelectronics Engineering
CAI Zhiwen1, XIAO Xiaoping2, WANG Xueliang1, SHAO Yonghong1, and ZHOU Jie1
[Abstract] [PDF: 2414KB]
DU Haijun1, 2, ZHANG Jianguo1, 2, LIU Haifang1, 2, GONG Lishuang1, 2, LIU Feng1, 2, and WANG Yuncai3
[Abstract] [PDF: 5045KB]