Information
JOURNAL OF SHENZHEN UNIVERSITY SCIENCE AND ENGINEERING
(Started in 1984, Bimonthly)
Responsible Institution
Shenzhen University
Sponsor
Shenzhen University
Edited by
Editorial Department of Journal of Shenzhen University Science and Engineering
Science Press
Chief editor
Li Qingquan
Distributed Domestically
Shenzhen Post Office
Distributed Abroad
China International Book Trading Corporation,(P.O.Box 399.Beijing,P.R.China)
Address
16 Donghuangchenggen North Street, Beijing 100717, P.R. China
Tel
0755-26732266
0755-26538306
Email:
journal@szu.edu.cn
 The Journal of Shenzhen University Science and Engineering is a general science and technology academic journal, managed and produced by Shenzhen University, and published by Science Press.It was first published in 1984. It is issued on a bimonthly basis (appearing on odd months) as an A4, 112-page magazine, distributed both domestically and overseas.
  The Journal publishes articles and letters covering a wide range of fields, including Electronics & Information Science, Optoelectronic Engineering,Architecture & Civil Engineering,  Bioengineering, Environmental Science & Energy,  Transportation Logistics, Chemistry & Chemical Engineering, Materials Science,Mathematics & Applied Mathematics, and Physics & Applied Physics.
  The Journal is recognized as a core Chinese science and technology journal by the Overview of Core Chinese Periodicals (published by the Peking University Library) and the Statistical Source Journal for Chinese Science and Technology Articles (published by the Institute of Scientific and Technical Information of China [ISTIC]). It is also indexed by many authoritative domestic and international databases, including the Chinese Science Citation Database (CSCD), the Annual Report for Chinese Academic Joural Impact Factors (Natural Science), SCOPUS (based in the Netherlands), INSPEC (based in UK), EBSCO(based in USA),and Zentralblatt MATH (based in Germany). The Journal’s 2020 impact factor was 0.738, and the 2020 5-year impact factor was 0.797.
  We warmly welcome high-quality contributions from researchers and scholars from around the world!
Current Issue
Accepted Paper
In Press
Optoelectronics Engineering
JIAN Nan, YIN Meijie, ZHANG Xi, and DIAO Dongfeng
[Abstract] [PDF: 16307KB]
LEI Yunfei, LIU Jinyuan, CAI Houzhi, WANG Dong,HUANG Junkun, WANG Yong, and DENG Pokun
[Abstract] [PDF: 5553KB]
DENG Pokun, CAI Houzhi, LONG Jinghua, WANG Dong, LEI Yunfei, HUANG Junkun, WANG Yong, and LIU Jinyuan
[Abstract] [PDF: 4971KB]
YE Zhixiang, HU Lufeng, LI Zhengkun, WANG Ning, and QIU Mingxia
[Abstract] [PDF: 3212KB]
LI Shichuan1, 2, CHAI Mengmeng1, 2, QIAO Lijun1, 2, ZHANG Mingjiang1, 2, WANG Tao1, 2, GAO Shaohua1, 2, and ZHANG Jianzhong1, 2
[Abstract] [PDF: 4569KB]
Architecture & Civil Engineering
SUN Hongfang, JIANG Ce, CAO Kun, XU Pinggui, and ZHANG Xiaogang
[Abstract] [PDF: 5418KB]
JIANG Jingwei1, LI Jingbo2, CUI Chunyi2, XU Minze2, SU Jian3, and ZHANG Peng2
[Abstract] [PDF: 4564KB]
Bioengineering
XIONG Wei1, 2, 3, ZHU Chengxin1, 2, WANG Yuting1, 2, ZHENG Yuan1, 2, LIU Lin1, 2, and MO Beixin1, 2
[Abstract] [PDF: 3757KB]
REN Chunyan1, 2, 3, WEI Zhiyuan1, 3, RAO Junhua4, RAO Yijian2, and CHEN Jianhuan1, 3
[Abstract] [PDF: 6210KB]
Electronics and Information Science
PENG Xiaobo1, HUANG Haina1, YANG Huiyue1, LIU Junhong1, and HUANG Ying2
[Abstract] [PDF: 5829KB]
ZHAO Qixiang, MA Mengshi, and ZHENG Shuquan
[Abstract] [PDF: 6146KB]